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Ball grid array (1) Land grid array (1) Pin grid array (1) Multi-chip module (1) Solid Logic Technology (1) Thin small outline package (1) Pin grid array (1) Ball grid array (1) Land grid array (1) Embedded wafer level ball grid array (1) Ball grid array (1) Land grid array (1) Multi-leaded power package (1) Small outline integrated circuit (1) Quad flat package (1) Chip carrier (1) Pin grid array (1) Through-hole technology (1) Flip chip (1) Flat no-leads package (1) Chip-scale package (1) Ball grid array (1) Land grid array (1) Through-hole technology (1) Pin grid array (1) Ball grid array (1) Multi-chip module (1) Through-hole technology (1) Land grid array (1) Pin grid array (1) Dual in-line package (1)
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Ball grid array

Surface-mount packaging that uses an array of solder balls

general/chip-carriers
Land grid array

Type of surface-mount packaging for integrated circuits

general/chip-carriers
Pin grid array

Type of integrated circuit packaging

general/chip-carriers
Multi-chip module

Electronic assembly containing multiple integrated circuits that behaves as a unit

general/chip-carriers
Solid Logic Technology

IBM hybrid circuit technology introduced in 1964

general/chip-carriers
Thin small outline package

Thin surface mount IC package

general/chip-carriers
Pin grid array

Type of integrated circuit packaging

general/chip-carriers
Ball grid array

Surface-mount packaging that uses an array of solder balls

general/chip-carriers
Land grid array

Type of surface-mount packaging for integrated circuits

general/chip-carriers
Embedded wafer level ball grid array

Packaging technology for integrated circuits

general/chip-carriers
Ball grid array

Surface-mount packaging that uses an array of solder balls

general/chip-carriers
Land grid array

Type of surface-mount packaging for integrated circuits

general/chip-carriers
Multi-leaded power package
general/chip-carriers
Small outline integrated circuit

Surface mount variant of DIP

general/chip-carriers
Quad flat package

Surface mount integrated circuit package with "gull wing" pins extending from all sides

general/chip-carriers
Chip carrier

Surface mount technology package for integrated circuits

general/chip-carriers
Pin grid array

Type of integrated circuit packaging

general/chip-carriers
Through-hole technology

Circuit board manufacturing technique

general/chip-carriers
Flip chip

Technique that flips a microchip upside down to connect it

general/chip-carriers
Flat no-leads package

Integrated circuit package with contacts on all 4 sides, on the underside of the package

general/chip-carriers
Chip-scale package

Integrated circuit package that is no or barely larger than the die it contains

general/chip-carriers
Ball grid array

Surface-mount packaging that uses an array of solder balls

general/chip-carriers
Land grid array

Type of surface-mount packaging for integrated circuits

general/chip-carriers
Through-hole technology

Circuit board manufacturing technique

general/chip-carriers
Pin grid array

Type of integrated circuit packaging

general/chip-carriers
Ball grid array

Surface-mount packaging that uses an array of solder balls

general/chip-carriers
Multi-chip module

Electronic assembly containing multiple integrated circuits that behaves as a unit

general/chip-carriers
Through-hole technology

Circuit board manufacturing technique

general/chip-carriers
Land grid array

Type of surface-mount packaging for integrated circuits

general/chip-carriers
Pin grid array

Type of integrated circuit packaging

general/chip-carriers
Dual in-line package

Type of electronic component package

general/chip-carriers