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Thin small outline package

Thin surface mount IC package

Summary

Thin surface mount IC package

An outline drawing of a Type I TSOP with 32 leads

Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1 mm) and have tight lead spacing (as low as 0.5 mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and EEPROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.

|access-date=December 17, 2021 |url-status=dead |archive-url=https://web.archive.org/web/20170211223522/http://glacier.lbl.gov/~gtp/DOM/dataSheets/Intel_Packaging.pdf |archive-date=February 11, 2017 }}

History

The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card. Texas Instruments. "Recent Advancements in Bus-Interface Packaging and Processing". 1997. p. 2

Physical properties

TSOP48 type I: [[Silicon Storage Technology]] 39F1601

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. SiliconFarEast: "TSOP - Thin Small Outline Package"

Type I

Part number	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
TSOP28	28	8.1	11.8	0.55
TSOP28/32	28/32	8	18.4	0.5
TSOP40	40	10	18.4	0.5
TSOP48	48	12	18.4	0.5
TSOP56	56	14	18.4	0.5

Type II

Part number	Pins	Body width (mm)	Body length (mm)	Lead pitch (mm)
TSOP6 (SOT457)	6	1.5	2.9	0.95
TSOP20/24/26	20/24/26	7.6	17.14	1.27
TSOP24/28	24/28	10.16	18.41	1.27
TSOP32	32	10.16	20.95	1.27
TSOP40/44	40/44	10.16	18.42	0.8
TSOP50	50	10.16	20.95	0.8
TSOP54	54	10.16	22.22	0.8
TSOP66	66	10.16	22.22	0.65

HTSOP

HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side. The pad is soldered to the PCB to transfer heat from the package to the PCB.

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs

Small-outline integrated circuit (SOIC)
Plastic small-outline package (PSOP)
Shrink small-outline package (SSOP)
Thin-shrink small outline package (TSSOP)

References

"Sc-74; Tsop6 (Sot457)".

Wikipedia Source

This article was imported from Wikipedia and is available under the Creative Commons Attribution-ShareAlike 4.0 License. Content has been adapted to SurfDoc format. Original contributors can be found on the article history page.

chip-carriers

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