From Surf Wiki (app.surf) — the open knowledge base
Engineering Technologist Mobility Forum
The Engineering Technologist Mobility Forum is an international forum held by signatories of the Sydney Accord to explore mutual recognition for experienced engineering technologists and to remove artificial barriers to the free movement and practice of engineering technologists amongst their countries. Signatories met in Sydney in November 1999 and Thornybush South Africa in June 2001. At their meeting on 25 June 2001, the Sydney Accord signatories established a forum, to be known as the Engineering Technologists Mobility Forum (ETMF).
Results
From these meetings an agreement was reached known as the Engineering Technologist Mobility Forum Memorandum of Understanding (ETMF MOU).http://www.washingtonaccord.org/ETMF/ETMF-Agreement.pdf The agreement provides a framework for members to recognise the equivalence in professional competence and standing of experienced engineering technologists.
The signatories also agreed to create and maintain a decentralised ETMF International Register of Engineering Technologists.
Members
- Canada - Represented by Canadian Council of Technicians and Technologists (2001)
- Hong Kong China - Represented by Hong Kong Institution of Engineers (2001)
- Ireland - Represented by Engineers Ireland (2001)
- New Zealand - Represented by Institution of Professional Engineers New Zealand (2001)
- South Africa - Represented by Engineering Council of South Africa (2001)
- United Kingdom - Represented by Engineering Council UK (2001)
References
References
This article was imported from Wikipedia and is available under the Creative Commons Attribution-ShareAlike 4.0 License. Content has been adapted to SurfDoc format. Original contributors can be found on the article history page.
Ask Mako anything about Engineering Technologist Mobility Forum — get instant answers, deeper analysis, and related topics.
Research with MakoFree with your Surf account
Create a free account to save articles, ask Mako questions, and organize your research.
Sign up freeThis content may have been generated or modified by AI. CloudSurf Software LLC is not responsible for the accuracy, completeness, or reliability of AI-generated content. Always verify important information from primary sources.
Report