From Surf Wiki (app.surf) — the open knowledge base
Die (integrated circuit)
Unpackaged integrated circuit
Unpackaged integrated circuit
In the context of integrated circuits, a die is a block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
There are three commonly used plural forms: dice, dies, and die. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms.
Manufacturing process
Main article: Semiconductor device fabrication
Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. From Sand to Silicon “Making of a Chip” Illustrations. (n.d.)
These wafers are then polished to a mirror finish before going through photolithography. In many steps the transistors are manufactured and connected with metal interconnect layers. These prepared wafers then go through wafer testing to test their functionality. The wafers are then sliced and sorted to filter out the faulty dies. Functional dies are then packaged and the completed integrated circuit is ready to be shipped.
Uses
A die can host many types of circuits. One common use case of an integrated circuit die is in the form of a central processing unit (CPU). Through advances in modern technology, the size of the transistor within the die has shrunk exponentially, following Moore's law. Other uses for dies can range from LED lighting to power semiconductor devices.
Images
Images of dies are commonly called die shots. File:2N2222.jpg|Single NPN bipolar junction transistor die File:Die of an infrared receiver..jpg|Die of an infrared receiver File:RGB-SMD-LED.jpg|Close-up of an RGB light-emitting diode, showing the three individual dies File:MC14053B internal view.jpg|A small-scale integrated-circuit die, with bond wires attached File:Diopsis.jpg|A VLSI integrated-circuit die File:Pentiumpro moshen.jpg|Two dies bonded onto one chip carrier File:Burr-Brown OPA103.jpg|A monolithic IC operational amplifier File:ICM7107.jpg|3 1/2 digit single-chip A/D converter File:SN7400 1965.jpg|SN7400 Quad NAND gate in flat pack package. 1965. File:CD-ROM Drive head die.jpg|CD-ROM drive head die File:Security camera CCD sensor.jpg|An old security camera CCD sensor File:1 watt 9 volt SMD LED.jpg|1-watt 9-volt SMD LED File:3 watt power LED after removing phosphor.jpg|6-volt 3-watt power LED. Wire bonds damaged in removing phosphor.
References
References
- John E. Ayers. (2004). "Digital Integrated Circuits". CRC Press.
- Robert Allen Meyers. (2000). "Encyclopedia of Physical Science and Technology". Academic Press.
- Intel]. (YouTube video, streamed on Nov 6, 2009)
This article was imported from Wikipedia and is available under the Creative Commons Attribution-ShareAlike 4.0 License. Content has been adapted to SurfDoc format. Original contributors can be found on the article history page.
Ask Mako anything about Die (integrated circuit) — get instant answers, deeper analysis, and related topics.
Research with MakoFree with your Surf account
Create a free account to save articles, ask Mako questions, and organize your research.
Sign up freeThis content may have been generated or modified by AI. CloudSurf Software LLC is not responsible for the accuracy, completeness, or reliability of AI-generated content. Always verify important information from primary sources.
Report